The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Jun. 17, 2010
Chi-chih Shen, Kaohsiung, TW;
Jen-chuan Chen, Taoyuan County, TW;
Hui-shan Chang, Taoyuan County, TW;
Wen-hsiung Chang, Hsinchu, TW;
Chi-Chih Shen, Kaohsiung, TW;
Jen-Chuan Chen, Taoyuan County, TW;
Hui-Shan Chang, Taoyuan County, TW;
Wen-Hsiung Chang, Hsinchu, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A package structure and a package process are proposed in using pillar bumps to connect an upper second chip and through silicon vias of a lower first chip, wherein a gap between the first chip and the second chip can be controlled by adjusting a height of the pillar bumps. In other words, the pillar bumps compensate the height difference between the first chip and a molding compound surrounding the first chip so as to ensure the bondibility between the pillar bumps and the corresponding through silicon vias and improve the process yield. Furthermore, the pillar bumps maintain the gap between the second chip and the molding compound for allowing an underfill being properly filled into the space between the first chip and the second chip.