The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Aug. 25, 2009
Chi-chih Shen, Kaohsiung, TW;
Jen-chuan Chen, Bade, TW;
Wen-hsiung Chang, Hsinchu, TW;
Chi-chih Chu, Kaohsiung, TW;
Cheng-yi Weng, Kaohsiung, TW;
Chi-Chih Shen, Kaohsiung, TW;
Jen-Chuan Chen, Bade, TW;
Wen-Hsiung Chang, Hsinchu, TW;
Chi-Chih Chu, Kaohsiung, TW;
Cheng-Yi Weng, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaosiung, TW;
Abstract
In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.