The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Aug. 15, 2008
Jen-chuan Chen, Taoyuan County, TW;
Chi-chih Shen, Kaohsiung City, TW;
Hui-shan Chang, Taoyuan County, TW;
Tommy Pan, Taipei, TW;
Jen-Chuan Chen, Taoyuan County, TW;
Chi-Chih Shen, Kaohsiung City, TW;
Hui-Shan Chang, Taoyuan County, TW;
Tommy Pan, Taipei, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A flip chip package structure including a chip, a carrier, and a plurality of bumps is provided. The chip has a bonding surface and a plurality of bump pads thereon. The carrier is disposed corresponding to the chip and includes a substrate and a plurality of pre-solders. The substrate has a carrying surface and a patterned trace layer thereon. The patterned trace layer has a plurality of traces, and each of the traces has an outward protruding bonding portion corresponding to the bump. The line width of the bonding portion is greater than that of the trace. The pre-solders are disposed on the bonding portions, respectively. The bumps are disposed between the bump pads and the corresponding pre-solders such that the chip is electrically connected to the carrier through the bumps.