The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Aug. 15, 2008
Chi-chih Shen, Kaohsiung, TW;
Jen-chuan Chen, Taoyuan County, TW;
Hui-shan Chang, Taoyuan County, TW;
Chi-Chih Shen, Kaohsiung, TW;
Jen-Chuan Chen, Taoyuan County, TW;
Hui-Shan Chang, Taoyuan County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A stacked type chip package structure including a package structure, a corresponding substrate, and a number of second bumps is provided. The package structure includes a first chip, a second chip, a number of first bumps, and a first underfill. The first chip is disposed above the second chip. The first bumps are disposed between the first chip and the second chip for electrically connecting the first chip and the second chip. The first underfill is used to fill between the first chip and the second chip and encapsulates the first bumps. The package structure is disposed above the corresponding substrate in a reverse manner, such that the first chip is disposed between the second chip and the corresponding substrate. The second bumps are disposed between the second chip and the corresponding substrate, such that the second chip is electrically connected to the corresponding substrate through the second bumps.