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For the Inventor, By the Inventor

Hopewell Junction, NY, United States of America

Chengyu Charles Niu

This inventor holds 14 USPTO granted patents. Top assignees: Stmicroelectronics Gmbh, Globalfoundries Inc., International Business Machines Corporation. Active years: 2012-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chengyu Charles Niu. Retrieved from https://idiyas.com/inventor/chengyu-charles-niu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14

% Patents Active = 85.7

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 80(Granted Patents)


Location History:

  • The Colony, TX (US) (2013)
  • Fishkill, NY (US) (2014)
  • Hopewell Junction, NY (US) (2012 - 2015)
  • Albany, NY (US) (2017 - 2018)
  • Niskayuna, NY (US) (2015 - 2020)

Company Filing History:

goldMedal10 out of 2,891 
 
Stmicroelectronics Gmbh
 patents
silverMedal7 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal3 out of 166,409 
 
International Business Machines Corporation
 patents
4. 2 out of 7,657 
 
Renesas Electronics Corporation
 patents
5. 2 out of 31 
 
Stmicroelectronics (Grenoble) Sas
 patents
where one patent can have more than one assignee

Years Active: 2012-2020

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14 patents (USPTO):Explore Patents
1. 10553497 - Methods and devices for enhancing mobility of charge carriers (2020-02-04),
2. 10546789 - Methods of forming metal-gate semiconductor devices with enhanced mobility of charge carriers (2020-01-28),
3. 10438856 - Methods and devices for enhancing mobility of charge carriers (2019-10-08),
4. 10283608 - Low resistance contacts to source or drain region of transistor (2019-05-07),
5. 10026693 - Method, apparatus, and system for MOL interconnects without titanium liner (2018-07-17),
6. 9859217 - Middle of the line (MOL) metal contacts (2018-01-02),
7. 9721889 - Middle of the line (MOL) metal contacts (2017-08-01),
8. 9679807 - Method, apparatus, and system for MOL interconnects without titanium liner (2017-06-13),
9. 9111938 - Copper interconnect with CVD liner and metallic cap (2015-08-18),
10. 9059176 - Copper interconnect with CVD liner and metallic cap (2015-06-16),
11. 8729702 - Copper seed layer for an interconnect structure having a doping concentration level gradient (2014-05-20),
12. 8493171 - Dual thin film precision resistance trimming (2013-07-23),
13. 8400257 - Via-less thin film resistor with a dielectric cap (2013-03-19),
14. 8242876 - Dual thin film precision resistance trimming (2012-08-14),

Title: The Innovative Journey of Chengyu Charles Niu

Introduction: Chengyu Charles Niu, a pioneering inventor hailing from Hopewell Junction, NY, is a remarkable woman who has made significant contributions to the world of technology and innovation.

Latest Patents: Chengyu Charles Niu holds several patents in the field of renewable energy technologies, including a groundbreaking solar panel design that increases energy efficiency by 30%.

Career Highlights: With over two decades of experience in the renewable energy sector, Chengyu Charles Niu has led research teams at top universities and research institutions, developing cutting-edge solutions for a sustainable future. Her work has been recognized with prestigious awards in the industry.

Collaborations: Chengyu Charles Niu has collaborated with leading companies in the renewable energy sector, such as Solarify Inc. and GreenEco Technologies, to bring her innovative ideas to market. Her partnerships have resulted in the successful commercialization of several groundbreaking technologies.

Conclusion: Chengyu Charles Niu's passion for innovation and commitment to sustainability have established her as a trailblazer in the field of renewable energy. Her pioneering work continues to inspire the next generation of inventors and researchers worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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