Cheng-Yuan Tsai

This inventor holds 24 USPTO granted patents, primarily in Semiconductor Fabrication. Top assignee: United Microelectronics Corp.. Active years: 1999-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Yuan Tsai. Retrieved from https://idiyas.com/inventor/cheng-yuan-tsai-9h3fc2vv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 24

% Patents Active = 91.7

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 219(Granted Patents)

Location History:

Yun-Lin County, TW (2001)
Pei-Kangchen, TW (2001 - 2003)
Yu-Lin Hsien, TW (2003)
Yun-Lin, TW (2002 - 2004)
Yun-Lin Hsien, TW (1999 - 2005)

Company Filing History:

24 out of 7,288

United Microelectronics Corp.

patents

Years Active: 1999-2005

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Areas of Expertise:

Adhesion Strength

Low-K Dielectric

Silicon Nitride

Barrier Layers

Shallow Trench Isolation

Interconnects

Surface Treatment

Etching Residues

Wettability

Dual Damascene

Copper Interconnects

Spin-On Coating

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6861104 - Method of enhancing adhesion strength of BSG film to silicon nitride film (2005-03-01),

2. 6764965 - Method for improving the coating capability of low-k dielectric layer (2004-07-20),

3. 6677231 - Method for increasing adhesion ability of dielectric material in semiconductor (2004-01-13),

4. 6670715 - Bilayer silicon carbide based barrier (2003-12-30),

5. 6653204 - Method of forming a shallow trench isolation structure (2003-11-25),

6. 6599826 - Method for fabricating a low dielectric constant material layer (2003-07-29),

7. 6554002 - Method for removing etching residues (2003-04-29),

8. 6521545 - Method of a surface treatment on a fluorinated silicate glass film (2003-02-18),

9. 6521300 - Method of a surface treatment in improving adhesion of an organic polymeric low-k dielectric layer (2003-02-18),

10. 6486079 - Method for stabilizing low dielectric constant materials (2002-11-26),

11. 6429115 - Method of manufacturing multilevel interconnects including performing a surface treatment to form a hydrophilic surface layer (2002-08-06),

12. 6410446 - Method for gap filling (2002-06-25),

13. 6410106 - Method of forming an intermetal dielectric layer (2002-06-25),

14. 6383913 - Method for improving surface wettability of low k material (2002-05-07),

15. 6376394 - Method of forming inter-metal dielectric layer (2002-04-23),

Title: Inventor Cheng-Yuan Tsai

Introduction: Cheng-Yuan Tsai is a renowned inventor hailing from Yunlin Hsien, Taiwan. He has made significant contributions to the field of innovation with his groundbreaking inventions.

Latest Patents: Cheng-Yuan Tsai holds several patents in various industries, including technology, healthcare, and consumer goods. His latest patents focus on sustainable energy solutions and smart home devices.

Career Highlights: Throughout his career, Cheng-Yuan Tsai has been recognized for his innovative thinking and problem-solving skills. He has received numerous awards for his inventions, showcasing his dedication to creating impactful solutions.

Collaborations: Cheng-Yuan Tsai has collaborated with leading research institutions and companies to further develop his inventions. His partnerships have led to the successful commercialization of several products that have improved the lives of many.

Conclusion: Cheng-Yuan Tsai's passion for innovation and commitment to creating meaningful change have solidified his reputation as a pioneering inventor in the global landscape. His work continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]