Chen-Jong Wang

This inventor holds 119 USPTO granted patents and 36 published patent applications, primarily in Semiconductor Imaging (CPC class H01L27-1463). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacuturing Company, Ltd. Active years: 1996-2026.

USPTO Granted Patents = 119 (Patent Applications = 36)

% Patents Active = 89.9

Average Co-Inventor Count = 4.0

ph-index = 17

Forward Citations = 1,319(Granted Patents)

Forward Citations (Not Self Cited) = 1,236(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Bao-Shan, TW (2016 - 2017)
Hsinchu County, TW (2019 - 2023)
Hsinchu, TW (1996 - 2024)

Company Filing History:

118 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 2

Taiwan Semiconductor Manufacuturing Company, Ltd

patents

Years Active: 1996-2026

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Areas of Expertise:

Semiconductor Imaging Device

High Density Image Sensor

Dark Current Performance

Hybrid Bonding

Capacitor Structure

Backside Illuminated Sensor

Image Sensor Scaling

Dicing Crack Prevention

Voltage Biased Shielding

Color Filter Array

Deep Trench Isolation

Wafer Arrangement

119 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12721175 - Device crack-stop structure to prevent damage due to dicing crack (2026-08-25),

2. 12707738 - CMOS image sensors and manufacturing methods thereof (2026-08-11),

3. 12701978 - Doping free connection structures and methods (2026-08-04),

4. 12684888 - Bonding structures for stacked image sensor (2026-07-14),

5. 12666730 - Stacked CMOS image sensor and method of manufacturing the same (2026-06-23),

6. 12622082 - Stacked CMOS image sensor with STI-free photodetector isolation and method for forming the same (2026-05-05),

7. 12615857 - Semiconductor imaging device having improved dark current performance (2026-04-28),

8. 12598825 - Substrate contact in wafer backside (2026-04-07),

9. 12581764 - Bond structure having shielding structures for stacked IC chips (2026-03-17),

10. 12557405 - Structure and method for backside-illuminated image device (2026-02-17),

11. 12557403 - High density image sensor (2026-02-17),

12. 12507490 - Semiconductor device including germanium region disposed in semiconductor substrate (2025-12-23),

13. 12408466 - High-speed readout image sensor (2025-09-02),

14. 12191336 - Image sensor having a gate dielectric structure for improved device scaling (2025-01-07),

15. 12057412 - Device crack-stop structure to prevent damage due to dicing crack (2024-08-06),

Title: Inventor Chen-Jong Wang

Introduction: Chen-Jong Wang is a renowned inventor based in Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chen-Jong Wang holds several patents in the areas of semiconductor technology, renewable energy, and telecommunications, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Wang has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Chen-Jong Wang has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge-sharing that has led to numerous successful projects and inventions.

Conclusion: Chen-Jong Wang's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology worldwide.