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For the Inventor, By the Inventor

Baoshan, China

Chang-Sheng Lin

This inventor holds 27 USPTO granted patents and 2 published patent applications, primarily in Chemical-Mechanical Polishing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang-Sheng Lin. Retrieved from https://idiyas.com/inventor/chang-sheng-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 74.1

Average Co-Inventor Count = 2.6

ph-index = 4

Forward Citations = 39(Granted Patents)


Location History:

  • Hs, TW (2014)
  • Hsinchu County, TW (2020)
  • Hsinchu, TW (2017 - 2022)
  • Baoshan Township, TW (2016 - 2024)

Company Filing History:

goldMedal27 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2024

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Areas of Expertise:
Chemical-Mechanical Polishing
Wafer Processing
Polishing System
CMP Slurry Solutions
Abrasive Structure
Integrated Circuit
Cleaning Method
Planarity Improvement
CMP Coatings
CMP Devices
Brush Cleaning Apparatus
Variable-Height Layers
27 patents (USPTO):Explore Patents
1. 12011803 - Carrier head having abrasive structure on retainer ring (2024-06-18),
2. 11694909 - Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method (2023-07-04),
3. 11458587 - Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system (2022-10-04),
4. 11312882 - CMP slurry solution for hardened fluid material (2022-04-26),
5. 11011385 - CMP-friendly coatings for planar recessing or removing of variable-height layers (2021-05-18),
6. 10916473 - Method of cleaning wafer after CMP (2021-02-09),
7. 10774241 - CMP slurry solution for hardened fluid material (2020-09-15),
8. 10770345 - Integrated circuit and fabrication method thereof (2020-09-08),
9. 10734254 - Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method (2020-08-04),
10. 10510594 - Method of cleaning wafer after CMP (2019-12-17),
11. 10504753 - Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method (2019-12-10),
12. 10377013 - Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system (2019-08-13),
13. 10312128 - Chemical-mechanical polish (CMP) devices, tools, and methods (2019-06-04),
14. 10300578 - Carrier head having abrasive structure on retainer ring (2019-05-28),
15. 10109523 - Method of cleaning wafer after CMP (2018-10-23),

Title: The Innovative Journey of Chang-Sheng Lin

Introduction:

Chang-Sheng Lin, a visionary inventor hailing from Baoshan, China, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Chang-Sheng Lin's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach.

Career Highlights:

With a career spanning over two decades, Chang-Sheng Lin has established himself as a pioneer in the tech industry, with a keen focus on developing solutions that address pressing global challenges. His innovative spirit and dedication to excellence have earned him recognition as a leading figure in the world of inventors.

Collaborations:

Throughout his career, Chang-Sheng Lin has collaborated with top research institutions, universities, and multinational companies to bring his inventions to life. His ability to work across disciplines and borders has led to the successful implementation of cutting-edge technologies in various sectors.

Conclusion:

In conclusion, Chang-Sheng Lin's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, has cemented his legacy as a trailblazer in the world of inventors. His work continues to inspire future generations to think boldly and create solutions that shape the world for the better.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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