The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Aug. 22, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Chang-Sheng Lin, Baoshan Township, TW;
Hsin-Hsien Lu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B24B 37/34 (2012.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67046 (2013.01); B24B 37/34 (2013.01); H01L 21/0209 (2013.01); H01L 21/67051 (2013.01);
Abstract
A method of processing a wafer is disclosed. The method includes, in some embodiments, causing a relative movement between a cleaning brush and a wafer. During the relative movement, a planar cleaning surface of the cleaning brush is brought into contact with a surface of the wafer to remove contaminants from the surface of the wafer. A first size of the cleaning brush, in a plan view, is larger than a second size of the wafer in the plan view.