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For the Inventor, By the Inventor

Hsinchu, Taiwan

Hsin-Hsien Lu

USPTO Granted Patents = 29 

Average Co-Inventor Count = 2.8

ph-index = 6

Forward Citations = 180(Granted Patents)


Location History:

  • Hs, TW (2014)
  • Hsin-Chu, TW (2004 - 2023)

Company Filing History:

goldMedal29 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2004-2023

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29 patents (USPTO):
1. 11705324 - Apparatus and method for wafer cleaning (2023-07-18),
2. 11694909 - Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method (2023-07-04),
3. 11594455 - Semiconductor device and manufacturing method for the same (2023-02-28),
4. 11458587 - Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system (2022-10-04),
5. 10998184 - Apparatus and method for wafer cleaning (2021-05-04),
6. 10770314 - Semiconductor device, tool, and method of manufacturing (2020-09-08),
7. 10734254 - Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method (2020-08-04),
8. 10504753 - Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method (2019-12-10),
9. 10377013 - Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system (2019-08-13),
10. 10325772 - Apparatus and method for wafer cleaning (2019-06-18),
11. 9852899 - Wafer back-side polishing system and method for integrated circuit device manufacturing processes (2017-12-26),
12. 9601409 - Protruding contact for integrated chip (2017-03-21),
13. 9597771 - Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system (2017-03-21),
14. 9576789 - Apparatus, method, and composition for far edge wafer cleaning (2017-02-21),
15. 9559021 - Wafer back-side polishing system and method for integrated circuit device manufacturing processes (2017-01-31),

Title: Innovations by Hsin-Hsien Lu in Wafer Cleaning Technologies

Introduction

Hsin-Hsien Lu, based in Hsinchu, Taiwan, is a prominent inventor with an impressive portfolio of 29 patents. His work primarily focuses on advancements in wafer cleaning technologies, which play a crucial role in semiconductor manufacturing.

Latest Patents

Among his latest innovations is an apparatus and method for wafer cleaning. This invention involves a polishing unit designed for chemical mechanical polishing (CMP) of a wafer, along with a cleaning dispensing unit that directs cleaning fluids toward the far edge of the wafer following the CMP process. Moreover, another noteworthy patent describes a brush cleaning apparatus and CMP system, which includes a wafer support and a cleaning brush made from porous material. The design ensures an effective cleaning mechanism by applying a cleaning liquid directly between the wafer and the cleaning surface.

Career Highlights

Hsin-Hsien Lu works at Taiwan Semiconductor Manufacturing Company Limited, a leader in the global semiconductor industry. His contributions have significantly enhanced the efficiency and effectiveness of wafer processing, solidifying his reputation within the field.

Collaborations

Throughout his career, Hsin-Hsien Lu has collaborated with esteemed colleagues such as Chang-Sheng Lin and Tien-I Bao. These partnerships have fostered an environment of innovation, driving the development of cutting-edge technologies in semiconductor wafer processing.

Conclusion

Hsin-Hsien Lu's contributions to wafer cleaning technologies exemplify the impact of innovative thinking in the semiconductor industry. With a robust collection of patents and a commitment to advancing the field, he continues to influence the future of semiconductor manufacturing.

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