The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Aug. 01, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Meng-Hsien Li, Hsinchu, TW;

Hsin-Hsien Lu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); B08B 3/08 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); B08B 7/00 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67023 (2013.01); B08B 3/08 (2013.01); B08B 7/0035 (2013.01); H01J 37/32899 (2013.01); H01L 21/02063 (2013.01); H01L 21/31111 (2013.01); H01L 21/67028 (2013.01); H01L 21/76813 (2013.01); H01L 21/76814 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 21/76832 (2013.01);
Abstract

A semiconductor device is manufactured using a cleaning process. The cleaning process utilizes a semiconductor manufacturing tool that has a wet cleaning section and a plasma cleaning section. The semiconductor device is placed within a wet cleaning chamber within the wet cleaning section, where a wet cleaning process is performed. Once completed, and without breaking atmosphere, the semiconductor device is removed from the wet cleaning section and placed within a plasma cleaning chamber within the plasma cleaning section. A plasma clean is then performed.


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