The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Jul. 18, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chang-Sheng Lin, Baoshan Township, TW;

Hsin-Hsien Lu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/30 (2012.01); B24B 37/32 (2012.01); B24B 37/04 (2012.01); B24B 37/10 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 37/042 (2013.01); B24B 37/105 (2013.01); B24B 37/20 (2013.01); B24B 37/30 (2013.01); B24B 37/32 (2013.01);
Abstract

Some embodiments relate to a carrier head. The carrier head includes a housing configured to enclose a wafer, wherein the housing includes a retaining ring recess configured to circumferentially surround the wafer. A retaining ring, which includes a first ring-shaped layer and a second ring-shaped layer, is disposed in the retaining ring recess. The second ring-shaped layer is disposed deeper in the retaining ring recess than the first ring-shaped layer and separates the first ring-shaped layer from a bottom of the retaining ring recess. A hardness of the second ring-shaped layer is less than a hardness of the first ring-shaped layer.


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