The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Dec. 31, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventor:
Chang-Sheng Lin, Baoshan Township, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); B24B 37/10 (2012.01); B24B 57/02 (2006.01); H01L 21/67 (2006.01); B24B 53/017 (2012.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68714 (2013.01); B24B 37/042 (2013.01); B24B 37/105 (2013.01); B24B 53/017 (2013.01); B24B 57/02 (2013.01); H01L 21/67075 (2013.01); H01L 21/67092 (2013.01);
Abstract
Chemical-mechanical polishing (CMP) devices, tools, and methods are disclosed. In some embodiments, a device for a CMP tool includes a carrier and an embedded dummy disk coupled to the carrier. The embedded dummy disk comprises a substrate and a film disposed over the substrate. The carrier is coupleable to an arm of a handler of the CMP tool. The carrier and the embedded dummy disk are adapted to be embedded within a housing of the CMP tool. The embedded dummy disk is adapted to be polished by the CMP tool in preparation for a polishing process for a wafer.