Chang-Pin Huang

This inventor holds 31 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang-Pin Huang. Retrieved from https://idiyas.com/inventor/chang-pin-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31

% Patents Active = 71.0

Average Co-Inventor Count = 6.3

ph-index = 4

Forward Citations = 78(Granted Patents)

Location History:

Yangmei, TW (2015)
Taoyuan, TW (2016 - 2019)
Yangmei Township, TW (2013 - 2020)
Taoyuan County, TW (2016 - 2023)

Company Filing History:

31 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2025

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Areas of Expertise:

Conductive Bump

Semiconductor Device

Hollow Metal Pillar

Manufacturing Method

Package Structure

Solder Regions

Optical Sensing

Integrated Circuit

MIM Capacitor

Wafer Level Chip Scale Package

Delamination Reduction

Shadow Pad

31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12278199 - Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications (2025-04-14),

2. 11837562 - Conductive bump of a semiconductor device and fabricating method thereof (2023-12-05),

3. 11469200 - Semiconductor device and manufacturing method thereof (2022-10-11),

4. 10985121 - Bump structure and fabricating method thereof (2021-04-20),

5. 10879198 - Package with solder regions aligned to recesses (2020-12-29),

6. 10854564 - Semiconductor device and manufacturing method thereof (2020-12-01),

7. 10825804 - Hollow metal pillar packaging scheme (2020-11-03),

8. 10354986 - Hollow metal pillar packaging scheme (2019-07-16),

9. 10269737 - Method for manufacturing semiconductor structure (2019-04-23),

10. 10262958 - Package with solder regions aligned to recesses (2019-04-16),

11. 10163828 - Semiconductor device and fabricating method thereof (2018-12-25),

12. 10062654 - Semicondcutor structure and semiconductor manufacturing process thereof (2018-08-28),

13. 10032737 - Semiconductor device and manufacturing method thereof (2018-07-24),

14. 9947630 - Package with solder regions aligned to recesses (2018-04-17),

15. 9943239 - Optical sensing system and associated electronic device (2018-04-17),

Title: The Innovative Journey of Inventor Chang-Pin Huang

Introduction:

Chang-Pin Huang, a talented inventor hailing from Yangmei, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chang-Pin Huang's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights:

Throughout his illustrious career, Chang-Pin Huang has been recognized for his pioneering work in the areas of clean energy and sustainable technology. His inventions have not only revolutionized the industry but have also had a positive impact on the environment.

Collaborations:

Chang-Pin Huang has collaborated with leading research institutions and universities around the world to further his research and bring his innovative ideas to life. His partnerships have been instrumental in pushing the boundaries of technological innovation.

Conclusion:

Inventor Chang-Pin Huang's dedication to creating a more sustainable future through his inventive spirit and groundbreaking technologies solidifies his position as a visionary in the world of innovation.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]