The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Mar. 07, 2016
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Hung-Yi Kuo, Taipei, TW;

Hao-Yi Tsai, Hsinchu, TW;

Hsien-Ming Tu, Hsinchu County, TW;

Shih-Wei Liang, Taichung County, TW;

Chang-Pin Huang, Taoyuan County, TW;

Chih-Hua Chen, Hsinchu County, TW;

Yu-Feng Chen, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/024 (2006.01); H04B 10/40 (2013.01); A61B 5/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/02427 (2013.01); A61B 5/721 (2013.01); H04B 10/40 (2013.01);
Abstract

An optical sensing system is disclosed. The optical sensing system includes a printed circuit board (PCB), a supporter and an optical sensor. The PCB includes a top surface, a bottom surface and a through cavity, wherein the through cavity extends downwardly from the top surface to the bottom surface. The supporter has a top surface and a bottom surface. The optical sensor is bonded and coupled to the top surface of the supporter, wherein the optical sensor includes a primary optic structure. Wherein the supporter is flipped over and bonded to the PCB with the top surface facing the through cavity, so that the optical sensor is coupled to the PCB and at least partially extends to the through cavity. Associated electronic devices are also disclosed.


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