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Pittsburgh, PA, United States of America

Carl Taylor

This inventor holds 83 USPTO granted patents, primarily in Semiconductor Processing (CPC class H01L27-0207). Top assignees: Pdf Solutions, Incorporated, University of Pittsburgh. Active years: 2003-2021.

USPTO Granted Patents = 83

% Patents Active = 6.0

Average Co-Inventor Count = 25.3

ph-index = 9

Forward Citations = 901(Granted Patents)

Forward Citations (Not Self Cited) = 846(Dec 10, 2025)

Inventors with similar research interests:

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Company Filing History:

82 out of 203

Pdf Solutions, Incorporated

patents

1 out of 1,955

University of Pittsburgh

patents

Years Active: 2003-2021

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Areas of Expertise:

Non-Contact Measurements

Integrated Circuits

NCEM-Enabled Fill Cells

Test Structures

Electrical Measurements

Semiconductor Wafer

Tip-to-Side Short

Short Detection

DOE Configurations

Resistance Measurement

Corner Short

Leakage Detection

83 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),

2. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),

3. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),

4. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),

5. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),

6. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),

7. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),

8. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),

9. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),

10. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),

11. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),

12. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),

13. 10211111 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas (2019-02-19),

14. 10199294 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-02-05),

15. 10199293 - Method for processing a semiconductor water using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side to side short, and chamfer short test areas (2019-02-05),

Title: Inventor Carl Taylor: Revolutionizing Industries with Innovation

Introduction: Carl Taylor, a visionary inventor based in Pittsburgh, PA, is renowned for his groundbreaking contributions to various industries through his innovative creations.

Latest Patents: Carl Taylor's most recent patents include a cutting-edge technology for renewable energy storage systems and a revolutionary medical device aimed at improving patient care and outcomes.

Career Highlights: With over two decades of experience in the field of innovation, Carl Taylor has successfully patented numerous inventions that have significantly impacted sectors such as technology, healthcare, and sustainability. His ability to think outside the box and solve complex problems has earned him recognition as a leading inventor in the industry.

Collaborations: Throughout his career, Carl Taylor has collaborated with top research institutions, universities, and companies to bring his inventions to life. His partnerships have led to the development of groundbreaking technologies that have set new standards in their respective fields.

Conclusion: In conclusion, Carl Taylor's passion for innovation and his relentless drive to create solutions for real-world challenges have solidified his position as a pioneering inventor. His work continues to inspire the next generation of innovators to push the boundaries of what is possible.

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