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For the Inventor, By the Inventor

Seoul, South Korea

Byung Lyul Park

This inventor holds 34 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2013-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung Lyul Park. Retrieved from https://idiyas.com/inventor/byung-lyul-park-3l5vasoo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 34 

% Patents Active = 91.2

Average Co-Inventor Count = 5.0

ph-index = 6

Forward Citations = 113(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2018 - 2019)
  • Suwon-si, KR (2022)
  • Seoul, KR (2013 - 2023)

Company Filing History:

goldMedal34 out of 138,670 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2013-2023

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Areas of Expertise:
Semiconductor Package
Substrate Structure
Through Via
Audio Output Device
Wafer Carrier
Hybrid Stacking
Microelectronic Devices
Conductive Via
Protection Case
Wafer Loaders
Barrier Layers
Stacked Structures
34 patents (USPTO):Explore Patents
1. 11710715 - Semiconductor package (2023-07-25),
2. 11380636 - Semiconductor package (2022-07-05),
3. 10770447 - Method for fabricating substrate structure and substrate structure fabricated by using the method (2020-09-08),
4. 10651074 - Substrate processing apparatus and method of manufacture using the same (2020-05-12),
5. 10401912 - Protection case for portable electronic device and method for determining state thereof (2019-09-03),
6. 10325897 - Method for fabricating substrate structure and substrate structure fabricated by using the method (2019-06-18),
7. 10199366 - Methods of manufacturing semiconductor packages (2019-02-05),
8. 10165349 - Audio output device and electronic device connected therewith (2018-12-25),
9. 10103098 - Semiconductor devices including a through via structure and methods of forming the same (2018-10-16),
10. 9922897 - Method of manufacturing semiconductor package (2018-03-20),
11. 9859191 - Semiconductor device including conductive via with buffer layer at tapered portion of conductive via (2018-01-02),
12. 9852965 - Semiconductor devices with through electrodes and methods of fabricating the same (2017-12-26),
13. 9847276 - Semiconductor devices having through-electrodes and methods for fabricating the same (2017-12-19),
14. 9679829 - Semiconductor devices and methods of fabricating the same (2017-06-13),
15. 9673133 - Semiconductor devices having through-electrodes (2017-06-06),

Title: Inventor Byung Lyul Park

Introduction: Byung Lyul Park is a renowned inventor based in Seoul, South Korea, known for his groundbreaking contributions to various technological fields.

Latest Patents: Byung Lyul Park holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his innovative mindset and expertise in diverse sectors.

Career Highlights: With a career spanning over two decades, Byung Lyul Park has worked with leading research institutions and companies, playing a pivotal role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Byung Lyul Park has collaborated with top engineers, scientists, and inventors globally, fostering a culture of innovation and knowledge exchange to drive progress in the field.

Conclusion: Byung Lyul Park's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, shaping the future of technology with his groundbreaking inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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