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For the Inventor, By the Inventor

Tualatin, OR, United States of America

Bryan L Buckalew

This inventor holds 77 USPTO granted patents and 20 published patent applications, primarily in Electroplating Technology (CPC class C25D). Top assignees: Novellus Systems Incorporated, Lam Research Corporation, Lam Research Comporation. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bryan L Buckalew. Retrieved from https://idiyas.com/inventor/bryan-l-buckalew

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 77 

% Patents Active = 98.7

Average Co-Inventor Count = 4.2

ph-index = 15

Forward Citations = 641(Granted Patents)

Forward Citations (Not Self Cited) = 395(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal39 out of 993 
 
Novellus Systems Incorporated
 patents
silverMedal37 out of 3,940 
 
Lam Research Corporation
 patents
bronzeMedal1 out of 1 
 
Lam Research Comporation
 patent

Years Active: 2005-2026

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Areas of Expertise:
Electroplating
Copper Bonding
Bubble Removal
Uniformity Profile
Wetting Pretreatment
Hydrodynamics
Anode Chamber
Redistribution Layer
Edge Removal
Dynamic Modulation
Flow Isolation
77 patents (USPTO):Explore Patents
1. 12674246 - Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate (2026-07-07),
2. 12559853 - Differential contrast plating for advanced packaging applications (2026-02-24),
3. 12424453 - Low temperature direct copper-copper bonding (2025-09-23),
4. 12331421 - Edge removal for through-resist plating in an electro-plating cup assembly (2025-06-17),
5. 12293943 - Gold through silicon mask plating (2025-05-06),
6. 12247310 - Lipseal edge exclusion engineering to maintain material integrity at wafer edge (2025-03-11),
7. 12157949 - Cross flow conduit for foaming prevention in high convection plating cells (2024-12-03),
8. 12134831 - Apparatus for an inert anode plating cell (2024-11-05),
9. 11746435 - Removing bubbles from plating cells (2023-09-05),
10. 11699590 - Copper electrodeposition sequence for the filling of cobalt lined features (2023-07-11),
11. 11655556 - Flow assisted dynamic seal for high-convection, continuous-rotation plating (2023-05-23),
12. 11585007 - Cross flow conduit for foaming prevention in high convection plating cells (2023-02-21),
13. 11560642 - Apparatus for an inert anode plating cell (2023-01-24),
14. 11549192 - Electroplating apparatus for tailored uniformity profile (2023-01-10),
15. 11450631 - Alternative integration for redistribution layer process (2022-09-20),

Title: The Innovative Mind of Bryan L Buckalew: Pioneering Solutions in Electroplating

Introduction:

In the realm of electroplating technology, one name stands out for his groundbreaking inventions and numerous patents - Bryan L Buckalew of Tualatin, OR (US).

Latest Patents:

Among his impressive portfolio of 69 patents, Bryan L Buckalew's latest accomplishments include revolutionary designs such as "Removing bubbles from plating cells" and "Copper electrodeposition sequence for the filling of cobalt lined features". These cutting-edge inventions showcase his profound understanding of electroplating techniques and his relentless pursuit of excellence in the field.

Career Highlights:

With a rich professional background, Bryan L Buckalew has lent his expertise to renowned companies such as Novellus Systems Incorporated and Lam Research Corporation. His work has not only pushed the boundaries of innovation but has also contributed significantly to the advancement of electroplating technologies.

Collaborations:

Throughout his illustrious career, Bryan L Buckalew has had the privilege of collaborating with esteemed professionals in the industry. Some of his notable coworkers include Steven T Mayer and Robert Rash, who have worked alongside him to bring his inventive ideas to fruition.

Conclusion:

In conclusion, Bryan L Buckalew's exceptional talent, unwavering dedication, and innovative spirit have made him a trailblazer in the field of electroplating. His legacy of groundbreaking patents continues to inspire future generations of inventors and has left an indelible mark on the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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