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Tualatin, OR, United States of America

Bryan L Buckalew

USPTO Granted Patents = 75 (Patent Applications = 21)

Average Co-Inventor Count = 4.2

ph-index = 14

Forward Citations = 622(Granted Patents)

Forward Citations (Not Self Cited) = 395(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

Novellus Systems Incorporated

35 out of 3,777

Lam Research Corporation

Lam Research Comporation

Years Active: 2005-2025

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Areas of Expertise:

Electroplating

Copper Electrodeposition

Wetting Wave Front Control

Dynamic Modulation

Inert Anode Plating

Hydrodynamics Enhancement

Redistribution Layer

Bubble Removal

Edge Flow Element

Nickel Electroplating

Through-Resist Plating

Copper-Copper Bonding

75 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12424453 - Low temperature direct copper-copper bonding (2025-09-23),

2. 12331421 - Edge removal for through-resist plating in an electro-plating cup assembly (2025-06-17),

3. 12293943 - Gold through silicon mask plating (2025-05-06),

4. 12247310 - Lipseal edge exclusion engineering to maintain material integrity at wafer edge (2025-03-11),

5. 12157949 - Cross flow conduit for foaming prevention in high convection plating cells (2024-12-03),

6. 12134831 - Apparatus for an inert anode plating cell (2024-11-05),

7. 11746435 - Removing bubbles from plating cells (2023-09-05),

8. 11699590 - Copper electrodeposition sequence for the filling of cobalt lined features (2023-07-11),

9. 11655556 - Flow assisted dynamic seal for high-convection, continuous-rotation plating (2023-05-23),

10. 11585007 - Cross flow conduit for foaming prevention in high convection plating cells (2023-02-21),

11. 11560642 - Apparatus for an inert anode plating cell (2023-01-24),

12. 11549192 - Electroplating apparatus for tailored uniformity profile (2023-01-10),

13. 11450631 - Alternative integration for redistribution layer process (2022-09-20),

14. 11214887 - Removing bubbles from plating cell (2022-01-04),

15. 11168407 - Copper electrodeposition on cobalt lined features (2021-11-09),

Title: The Innovative Mind of Bryan L Buckalew: Pioneering Solutions in Electroplating

Introduction:

In the realm of electroplating technology, one name stands out for his groundbreaking inventions and numerous patents - Bryan L Buckalew of Tualatin, OR (US).

Latest Patents:

Among his impressive portfolio of 69 patents, Bryan L Buckalew's latest accomplishments include revolutionary designs such as "Removing bubbles from plating cells" and "Copper electrodeposition sequence for the filling of cobalt lined features". These cutting-edge inventions showcase his profound understanding of electroplating techniques and his relentless pursuit of excellence in the field.

Career Highlights:

With a rich professional background, Bryan L Buckalew has lent his expertise to renowned companies such as Novellus Systems Incorporated and Lam Research Corporation. His work has not only pushed the boundaries of innovation but has also contributed significantly to the advancement of electroplating technologies.

Collaborations:

Throughout his illustrious career, Bryan L Buckalew has had the privilege of collaborating with esteemed professionals in the industry. Some of his notable coworkers include Steven T Mayer and Robert Rash, who have worked alongside him to bring his inventive ideas to fruition.

Conclusion:

In conclusion, Bryan L Buckalew's exceptional talent, unwavering dedication, and innovative spirit have made him a trailblazer in the field of electroplating. His legacy of groundbreaking patents continues to inspire future generations of inventors and has left an indelible mark on the world of technology.

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