The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Jan. 04, 2021
Applicant:

Novellus Systems, Inc., Fremont, CA (US);

Inventors:

Steven T. Mayer, Aurora, OR (US);

David W. Porter, Sherwood, OR (US);

Bryan L. Buckalew, Tualatin, OR (US);

Robert Rash, West Linn, OR (US);

Assignee:

Novellus Systems, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 5/18 (2006.01); C25D 17/12 (2006.01); C25D 21/12 (2006.01); C25D 17/06 (2006.01); C25D 7/12 (2006.01); H01L 21/288 (2006.01); C25D 21/10 (2006.01); C25D 5/04 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); C25D 5/04 (2013.01); C25D 5/18 (2013.01); C25D 17/002 (2013.01); C25D 17/007 (2013.01); C25D 17/008 (2013.01); C25D 17/06 (2013.01); C25D 17/12 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01); H01L 21/2885 (2013.01); C25D 7/123 (2013.01); H01L 21/76873 (2013.01);
Abstract

An electroplating apparatus for electroplating metal on a substrate includes a plating chamber configured to contain an electrolyte, a substrate holder configured to hold and rotate the substrate during electroplating, an anode, and an azimuthally asymmetric auxiliary electrode configured to be biased both anodically and cathodically during electroplating. The azimuthally asymmetric auxiliary electrode (which may be, for example, C-shaped), can be used for controlling azimuthal uniformity of metal electrodeposition by donating and diverting ionic current at a selected azimuthal position. In another aspect, an electroplating apparatus for electroplating metal includes a plating chamber configured to contain an electrolyte, a substrate holder configured to hold and rotate the substrate during electroplating, an anode, a shield configured to shield current at the periphery of the substrate; and an azimuthally asymmetric auxiliary anode configured to donate current to the shielded periphery of the substrate at a selected azimuthal position on the substrate.


Find Patent Forward Citations

Loading…