The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Jul. 22, 2020
Lam Research Corporation, Fremont, CA (US);
Stephen J. Banik, II, Philadelphia, PA (US);
Jacob Kurtis Blickensderfer, Portland, OR (US);
Kailash Venkatraman, Portland, OR (US);
Justin Oberst, Beaverton, OR (US);
Lee Peng Chua, Beaverton, OR (US);
Bryan L. Buckalew, Tualatin, OR (US);
Steven T. Mayer, Aurora, OR (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A method of electroplating a metal into features, having substantially different depths, of a partially fabricated electronic device on a substrate is provided. The method includes adsorbing accelerator into the bottom of recessed features; partially filling the features by a bottom up fill mechanism in an electroplating solution; diffusing leveler into shallow features to decrease the plating rate in shallow features as compared to deep features; and electroplating more metal into the features such that the height of metal in deep features is similar to the height of metal in shallow features.