Branford, CT, United States of America

Brian Lewis

USPTO Granted Patents = 21 

 


Average Co-Inventor Count = 2.7

ph-index = 7

Forward Citations = 154(Granted Patents)


Location History:

  • Jersey City, NJ (US) (2010)
  • Branford, CT (US) (1986 - 2018)

Company Filing History:


Years Active: 1986-2018

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21 patents (USPTO):Explore Patents

Title: Innovations by Brian Lewis

Introduction

Brian Lewis is a notable inventor based in Branford, Connecticut, who has made significant contributions to the field of electrical device interconnects. With a total of 13 patents to his name, Lewis has focused on developing materials and methods that enhance the performance and reliability of electrical devices.

Latest Patents

Among his latest patents, Lewis has developed materials specifically designed for use in interconnects of electrical devices, such as printed circuit boards and solar cells. One of his notable inventions involves a two-step solder that aims to reduce stresses on the materials used in the production of these devices. Additionally, he has created a solder alloy suitable for various soldering processes, which includes a precise combination of elements such as bismuth, copper, silver, and tin, among others. This alloy is engineered to improve the efficiency and effectiveness of soldering in electronic applications.

Career Highlights

Throughout his career, Brian Lewis has worked with reputable companies in the industry, including Fry's Metals, Inc. and Alpha Metals, Inc. His experience in these organizations has allowed him to refine his skills and contribute to innovative solutions in the field of electrical engineering.

Collaborations

Lewis has collaborated with several talented individuals, including Bawa Singh and Michael T. Marczi. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies and materials.

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