Brian Lewis

This inventor holds 21 USPTO granted patents and 3 published patent applications, plus 3 CIPO patents and 5 EPO patents, primarily in Electromagnetic Casting. Top assignees: Fry's Metals, Inc., Olin Corporation, Alpha Metals, Inc.. Active years: 1986-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Lewis. Retrieved from https://idiyas.com/inventor/brian-lewis-svgo16ix

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 (Patent Applications = 3)

% Patents Active = 85.7

CIPO Patents = 3 (Patent Applications = 1)

EPO Patents = 5

Average Co-Inventor Count = 2.7

ph-index = 7

Forward Citations = 154(Granted Patents)

Location History:

Jersey City, NJ (US) (2010)
Branford, CT (US) (1986 - 2018)

Company Filing History:

Alpha Assembly Solutions Inc.

patents

5. 1 out of 32

Specialty Coating Systems, Inc.

patents

6. 1 out of 834,570

Other

patents

Years Active: 1986-2018

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Areas of Expertise:

Electromagnetic Casting

Solder Alloys

Thermal Interface Materials

Electrokinetic Deposition

Metallic Particles

Lead-Free Soldering

Heat Sink Configuration

Joint Embrittlement

Microstructures

Nanostructures

Patterning Process

Magnetic Field Nozzle

21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10123430 - Materials for use with interconnects of electrical devices and related methods (2018-11-06),

2. 9221131 - Solder alloy (2015-12-29),

3. 9217088 - Particles and inks and films using them (2015-12-22),

4. 8641964 - Solder alloy (2014-02-04),

5. 8252417 - Metallic particles for electrokinetic or electrostatic deposition (2012-08-28),

6. 8191757 - Reducing joint embrittlement in lead-free soldering processes (2012-06-05),

7. 7968008 - Particles and inks and films using them (2011-06-28),

8. 7678255 - Mask and method for electrokinetic deposition and patterning process on substrates (2010-03-16),

9. 7663242 - Thermal interface material and solder preforms (2010-02-16),

10. 7585549 - Method of applying a pattern of particles to a substrate (2009-09-08),

11. 7413805 - Preparation of metallic particles for electrokinetic or electrostatic deposition (2008-08-19),

12. 7387813 - Methods of preparation of hollow microstructures and nanostructures (2008-06-17),

13. 7187083 - Thermal interface material and solder preforms (2007-03-06),

14. 6653741 - Thermal interface material and heat sink configuration (2003-11-25),

15. 4953487 - Electromagnetic solder tinning system (1990-09-04),

Title: Innovations by Brian Lewis

Introduction

Brian Lewis is a notable inventor based in Branford, Connecticut, who has made significant contributions to the field of electrical device interconnects. With a total of 13 patents to his name, Lewis has focused on developing materials and methods that enhance the performance and reliability of electrical devices.

Latest Patents

Among his latest patents, Lewis has developed materials specifically designed for use in interconnects of electrical devices, such as printed circuit boards and solar cells. One of his notable inventions involves a two-step solder that aims to reduce stresses on the materials used in the production of these devices. Additionally, he has created a solder alloy suitable for various soldering processes, which includes a precise combination of elements such as bismuth, copper, silver, and tin, among others. This alloy is engineered to improve the efficiency and effectiveness of soldering in electronic applications.

Career Highlights

Throughout his career, Brian Lewis has worked with reputable companies in the industry, including Fry's Metals, Inc. and Alpha Metals, Inc. His experience in these organizations has allowed him to refine his skills and contribute to innovative solutions in the field of electrical engineering.

Collaborations

Lewis has collaborated with several talented individuals, including Bawa Singh and Michael T. Marczi. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies and materials.

Profile summary based on public USPTO records.