The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

Jun. 24, 2011
Applicants:

Sachin Parashar, Delhi, IN;

Siuli Sarkar, Bangalore, IN;

Oscar Khaselev, Monmouth Junction, NJ (US);

Brian G. Lewis, Branford, CT (US);

Michael T. Marczi, Chester, NJ (US);

Bawa Singh, Voorhees, NJ (US);

Nitin Desai, Princeton Junction, NJ (US);

Michael Liberatore, Jersey City, NJ (US);

Inventors:

Sachin Parashar, Delhi, IN;

Siuli Sarkar, Bangalore, IN;

Oscar Khaselev, Monmouth Junction, NJ (US);

Brian G. Lewis, Branford, CT (US);

Michael T. Marczi, Chester, NJ (US);

Bawa Singh, Voorhees, NJ (US);

Nitin Desai, Princeton Junction, NJ (US);

Michael Liberatore, Jersey City, NJ (US);

Assignee:

ALPHA METALS, INC., South Plainfield, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/03 (2014.01); B22F 1/00 (2006.01); B22F 9/24 (2006.01); B82Y 30/00 (2011.01); C09D 7/12 (2006.01); C09D 11/00 (2014.01); C09D 11/38 (2014.01); C23C 24/08 (2006.01); C23C 26/00 (2006.01); H01B 1/02 (2006.01); H01L 51/00 (2006.01); H05K 1/09 (2006.01); C08K 3/08 (2006.01); C08K 9/04 (2006.01);
U.S. Cl.
CPC ...
C09D 11/03 (2013.01); B22F 1/0018 (2013.01); B22F 1/0022 (2013.01); B22F 1/0062 (2013.01); B22F 9/24 (2013.01); B82Y 30/00 (2013.01); C09D 7/1225 (2013.01); C09D 7/1266 (2013.01); C09D 11/00 (2013.01); C09D 11/38 (2013.01); C23C 24/08 (2013.01); C23C 26/00 (2013.01); H01B 1/02 (2013.01); H01L 51/0022 (2013.01); H05K 1/097 (2013.01); C01P 2002/84 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C08K 3/08 (2013.01); C08K 9/04 (2013.01); H05K 2201/0224 (2013.01); Y10T 428/2982 (2015.01); Y10T 428/2991 (2015.01);
Abstract

Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.


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