The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2010

Filed:

Mar. 06, 2007
Applicants:

Brian G. Lewis, Jersey City, NJ (US);

Bawa Singh, Jersey City, NJ (US);

John P. Laughlin, Tucson, AZ (US);

David V. Kyaw, Tucson, AZ (US);

Anthony E. Ingham, Surrey GUZ1 5RZ, GB;

Attiganal N. Sreeram, Midland, MI (US);

Leszek Hozer, Jersey City, NJ (US);

Michael J. Liberatore, Jersey City, NJ (US);

Gerard R. Minogue, Yorba Linda, CA (US);

Inventors:

Brian G. Lewis, Jersey City, NJ (US);

Bawa Singh, Jersey City, NJ (US);

John P. Laughlin, Tucson, AZ (US);

David V. Kyaw, Tucson, AZ (US);

Anthony E. Ingham, Surrey GUZ1 5RZ, GB;

Attiganal N. Sreeram, Midland, MI (US);

Leszek Hozer, Jersey City, NJ (US);

Michael J. Liberatore, Jersey City, NJ (US);

Gerard R. Minogue, Yorba Linda, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.


Find Patent Forward Citations

Lewis, Brian. (2010). Thermal interface material and solder preforms (U.S. Patent No. 7663242). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7663242

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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