David V Kyaw

Title: The Innovative Contributions of David V Kyaw

Introduction

David V Kyaw is a notable inventor based in Tucson, AZ. He has made significant contributions to the field of thermal interface materials and solder preforms. With a total of 2 patents, his work focuses on enhancing the performance and reliability of solder materials.

Latest Patents

David's latest patents include innovative designs for thermal interface materials and solder preforms. One of his patents describes a solder preform that consists of multiple layers, including a solder layer filled with additives interposed between two unfilled layers to improve wettability. Another patent features a solder preform with a spherical design that contains solder material filled with additives, along with an unfilled surface layer for enhanced wettability. Additionally, he has developed a thermal interface material that incorporates a bonding component and an additive component, which serves as a CTE modifying component and/or a thermal conductivity enhancement component. His work also includes active solders that contain intrinsic oxygen getters.

Career Highlights

Throughout his career, David has worked with various companies, including Fry's Metals, Inc. His experience in the industry has allowed him to refine his skills and contribute to advancements in solder technology.

Collaborations

David has collaborated with notable individuals such as Bawa Singh and John P Laughlin. These partnerships have further enriched his work and led to innovative solutions in his field.

Conclusion

David V Kyaw's contributions to the field of thermal interface materials and solder preforms demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and a drive to improve technology in practical applications.