The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Nov. 25, 2003
Brian G. Lewis, Branford, CT (US);
Bawa Singh, Voorhees, NJ (US);
John P. Laughlin, Duncansville, PA (US);
David V. Kyaw, Roaring Springs, PA (US);
Anthony E. Ingham, Woking, GB;
Attiganal N. Sreeram, Raleigh, NC (US);
Leszek Hozer, Plainsboro, NJ (US);
Michael J. Liberatore, Trenton, NJ (US);
Gerard R. Minogue, Yorba Linda, CA (US);
Brian G. Lewis, Branford, CT (US);
Bawa Singh, Voorhees, NJ (US);
John P. Laughlin, Duncansville, PA (US);
David V. Kyaw, Roaring Springs, PA (US);
Anthony E. Ingham, Woking, GB;
Attiganal N. Sreeram, Raleigh, NC (US);
Leszek Hozer, Plainsboro, NJ (US);
Michael J. Liberatore, Trenton, NJ (US);
Gerard R. Minogue, Yorba Linda, CA (US);
Fry's Metals, Inc., Jersey City, NJ (US);
Abstract
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.