Plainsboro, NJ, United States of America

Leszek Hozer



Average Co-Inventor Count = 4.5

ph-index = 7

Forward Citations = 202(Granted Patents)


Location History:

  • Lawrenceville, NJ (US) (2000 - 2001)
  • West Windsor, NJ (US) (2002)
  • Plainsboro, NJ (US) (2003 - 2007)
  • Jersey City, NJ (US) (2010)

Company Filing History:


Years Active: 2000-2010

Loading Chart...
Loading Chart...
12 patents (USPTO):Explore Patents

Title: Leszek Hozer: Innovator in Thermal Interface Materials and Solder Preforms

Introduction

Leszek Hozer is a prominent inventor based in Plainsboro, NJ (US). He has made significant contributions to the field of thermal interface materials and solder preforms, holding a total of 12 patents. His innovative work has advanced the technology used in various applications, particularly in electronics.

Latest Patents

Hozer's latest patents include a range of advancements in solder preforms and thermal interface materials. One notable patent describes a solder preform with multiple layers, featuring a solder layer filled with additives interposed between two unfilled layers to improve wettability. Another patent details a solder preform that contains a sphere filled with solder material and additives, along with an unfilled surface layer for enhanced wettability. Additionally, he has developed a thermal interface material that incorporates a bonding component and an additive component, which serves as a CTE modifying component and/or a thermal conductivity enhancement component. His work also includes active solders that contain intrinsic oxygen getters.

Career Highlights

Throughout his career, Leszek Hozer has worked with notable companies such as Sarnoff Corporation and Fry's Metals, Inc. His experience in these organizations has allowed him to refine his expertise and contribute to significant advancements in his field.

Collaborations

Hozer has collaborated with talented individuals, including Attiganal Narayanaswamy Sreeram and Michael James Liberatore. These collaborations have further enriched his work and led to innovative solutions in thermal interface materials and solder technology.

Conclusion

Leszek Hozer's contributions to the field of thermal interface materials and solder preforms demonstrate his commitment to innovation and excellence. His patents and collaborations reflect a deep understanding of the technical challenges in electronics, making him a valuable figure in the industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…