The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2004

Filed:

Oct. 30, 2002
Applicant:
Inventors:

Mark Stuart Hammond, Pennington, NJ (US);

Ellen Schwartz Tormey, Princeton Junction, NJ (US);

Barry Jay Thaler, Lawrenceville, NJ (US);

Leszek Hozer, Plainsboro, NJ (US);

Hung-tse Daniel Chen, San Jose, CA (US);

Bernard Dov Geller, Durham, NC (US);

Gerard Frederickson, Yardley, PA (US);

Assignee:

Lamina Ceramics, Inc., Westampton, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/02 ;
U.S. Cl.
CPC ...
H05K 3/02 ;
Abstract

A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.


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