Hung-tse Daniel Chen

Title: Innovations of Hung-tse Daniel Chen

Introduction

Hung-tse Daniel Chen is an accomplished inventor based in San Jose, CA. He holds a total of 3 patents that showcase his expertise in electronic component packaging and circuit board technology. His innovative work has contributed significantly to advancements in the field.

Latest Patents

One of his latest patents is a method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate. This invention includes a metal support substrate with a pattern of openings and a body of insulating material, such as glass or ceramic, bonded to the substrate's surface. The body consists of multiple layers of insulating material, with conductive vias extending through these layers to the support substrate. An electronic component is directly mounted in an opening within the insulating body, allowing for efficient integration with a motherboard. Another patent focuses on ceramic multilayer circuit boards mounted on a patterned metal support substrate, emphasizing similar features and benefits for electronic component packaging.

Career Highlights

Hung-tse has worked with notable companies, including Lamina Ceramics and Lamina Ceramics, Inc. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the electronics industry.

Collaborations

He has collaborated with esteemed colleagues such as Barry Jay Thaler and Mark Stuart Hammond, further enhancing his contributions to the field.

Conclusion

Hung-tse Daniel Chen's innovative patents and career achievements reflect his significant impact on electronic component technology. His work continues to influence advancements in the industry, showcasing the importance of innovation in modern electronics.