The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Oct. 17, 2007
Applicants:
Michael T. Marczi, Chester, NJ (US);
Paul Koep, Madison, NJ (US);
Michiel A. DE Monchy, Utrecht, NL;
Martinus N Finke, De Meern, NL;
Brian Lewis, Branford, CT (US);
Inventors:
Michael T. Marczi, Chester, NJ (US);
Paul Koep, Madison, NJ (US);
Michiel A. de Monchy, Utrecht, NL;
Martinus N Finke, De Meern, NL;
Brian Lewis, Branford, CT (US);
Assignee:
Alpha Assembly Solutions Inc., Somerset, NJ (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); H05K 3/34 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); H01L 31/02 (2006.01); H01L 31/048 (2014.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3484 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B23K 35/302 (2013.01); H01L 31/02008 (2013.01); H01L 31/048 (2013.01); H05K 3/341 (2013.01); H01L 23/3736 (2013.01); H01L 24/83 (2013.01); H01L 2224/8181 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/83224 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13055 (2013.01); H05K 3/3463 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10992 (2013.01); H05K 2203/0415 (2013.01); Y02E 10/50 (2013.01); Y02P 70/613 (2015.11);
Abstract
Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.