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For the Inventor, By the Inventor

Waterbury, CT, United States of America

Alpha Assembly Solutions Inc.


USPTO Granted Patents = 45



Trademarks = 36

Forward Citations = 14

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81 inventors (with patents filed for the assignee):

goldMedal Bawa Singh (26 out of 75 patents)

silverMedal Siuli Sarkar (18 out of 25 patents)

bronzeMedal Oscar Khaselev (14 out of 27 patents)

4.  Ranjit Pandher (12 out of 17 patents)

5.  Michael T Marczi (11 out of 22 patents)

6.  Monnir Boureghda (9 out of 10 patents)

7.  Sutapa Mukherjee (8 out of 9 patents)

8.  Anubhav Rustogi (8 out of 8 patents)

9.  Rahul Raut (8 out of 13 patents)

10.  Nirmalya Kumar Chaki (7 out of 7 patents)

11.  Ravi Bhatkal (7 out of 7 patents)

12.  Anna Lifton (6 out of 9 patents)

13.  Narahari Pujari (5 out of 8 patents)

14.  Md Hasnine (5 out of 5 patents)

15.  Lik Wai Kho (5 out of 5 patents)


Core Competencies:
Lead-Free Solder Alloy
Sintering Materials
Stretchable Interconnects
Dielectric Ink Composition
Graphene Enhanced Materials
Nano Copper Paste
Low Temperature Soldering
Composite Silver Films
Engineered Polymer Materials
Electrical Connection Tape
Jettable Inks
Conductive Patterns

45 patents:

1. 12497532 - Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures (2025-12-16),
2. 12438121 - Sintering materials and attachment methods using same (2025-10-07),
3. 12421574 - High reliability lead-free solder alloy for electronic applications in extreme environments (2025-09-23),
4. 12388042 - Solder material and method for die attachment (2025-08-12),
5. 12278022 - Stretchable interconnects for flexible electronic surfaces (2025-04-14),
6. 12246376 - Sinter-ready silver films (2025-03-11),
7. 12233483 - Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications (2025-02-25),
8. 12122679 - Applications of engineered graphene (2024-10-22),
9. 12115602 - Lead-free solder compositions (2024-10-15),
10. 12113039 - Low pressure sintering powder (2024-10-08),
11. 12084583 - Dielectric ink composition (2024-09-10),
12. 11929341 - Nano copper paste and film for sintered die attach and similar applications (2024-03-12),
13. 11842974 - Solder material and method for die attachment (2023-12-12),
14. 11830640 - Stretchable interconnects for flexible electronic surfaces (2023-11-28),
15. 11732330 - High reliability lead-free solder alloy for electronic applications in extreme environments (2023-08-22),
Alpha Assembly Solutions Inc. is a global leader in the development, manufacturing, and sales of innovative materials used in electronic assembly processes. With a wide range of products and solutions tailored for the electronics industry, Alpha Assembly Solutions delivers high-performance materials that enable the production of reliable and durable electronic devices. The company serves various sectors, including automotive, telecommunications, aerospace, consumer electronics, and more.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 23 2025

45 Patents

#3 in Waterbury, CT

#179 in Connecticut

#7,493 in US

#14,972 in the World

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Waterbury, CT, United States of America

Alpha Assembly Solutions Inc.

Forward Citations = 14

81 inventors:

goldMedal Bawa Singh (26 out of 75 patents)

silverMedal Siuli Sarkar (18 out of 25 patents)

bronzeMedal Oscar Khaselev (14 out of 27 patents)

4.  Ranjit Pandher (12 out of 17 patents)

5.  Michael T Marczi (11 out of 22 patents)

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