The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Nov. 12, 2021
Applicant:

Alpha Assembly Solutions Inc., Waterbury, CT (US);

Inventors:

Narahari Pujari, Bangalore, IN;

Jayaprakash Sundaramurthy, Bangalore, IN;

Siuli Sarkar, Bangalore, IN;

Ravindra M. Bhatkal, East Brunswick, NJ (US);

Assignee:

Alpha Assembly Solutions Inc., Waterbury, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/322 (2014.01); B41F 15/40 (2006.01); B41M 5/00 (2006.01); C09D 11/037 (2014.01); C09D 11/101 (2014.01); C09D 11/102 (2014.01); C09D 11/104 (2014.01); C09D 11/107 (2014.01); C09D 11/38 (2014.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); C09D 11/30 (2014.01);
U.S. Cl.
CPC ...
C09D 11/322 (2013.01); B41F 15/40 (2013.01); B41M 5/0023 (2013.01); C09D 11/037 (2013.01); C09D 11/101 (2013.01); C09D 11/102 (2013.01); C09D 11/104 (2013.01); C09D 11/107 (2013.01); C09D 11/38 (2013.01); H05K 1/0393 (2013.01); H05K 3/0011 (2013.01); C09D 11/30 (2013.01); H05K 2201/0133 (2013.01);
Abstract

The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.


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