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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12686052 B1

PDFFull Text
Date of Patent:
Jul. 21, 2026

Filed:

Sep. 24, 2020

Sintering composition

Applicant:

Alpha Assembly Solutions Inc., Waterbury, CT (US);

Inventors:

Shamik Ghoshal, Waterbury, CT (US);

Nirmalya Kumar Chaki, Waterbury, CT (US);

Remya Chandran, Waterbury, CT (US);

Manoharan Venodh, Waterbury, CT (US);

Bawa Singh, Waterbury, CT (US);

Barun Das, Waterbury, CT (US);

Niveditha Nagarajan, Waterbury, CT (US);

Rahul Raut, Waterbury, CT (US);

Oscar Khaselev, Waterbury, CT (US);

Ranjit Pandher, Waterbury, CT (US);

Supriya Devarajan, Waterbury, CT (US);

Anubhav Rustogi, Waterbury, CT (US);

Assignee:

ALPHA ASSEMBLY SOLUTIONS INC., Waterbury, CT (US);

Attorney:

Stinson LLP

Primary Examiner:

Mark Kopec

Int. Cl.
CPC ...
H01B 1/20 (2006.01); B05D 5/12 (2006.01); B22F 1/107 (2022.01); B22F 7/04 (2006.01); B22F 9/30 (2006.01); B23K 35/30 (2006.01); H01B 1/02 (2006.01); H01B 13/012 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/3485 (2026.01); H05K 3/3494 (2026.01); B23K 101/38 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
B22F 7/04 (2013.01); B05D 5/12 (2013.01); B22F 1/107 (2022.01); B22F 9/30 (2013.01); B23K 35/3006 (2013.01); H01B 1/02 (2013.01); H01B 1/20 (2013.01); H01B 13/01209 (2013.01); H05K 1/097 (2013.01); H05K 3/1216 (2013.01); H05K 3/1283 (2013.01); H05K 3/3485 (2020.08); H05K 3/3494 (2013.01); B22F 2007/047 (2013.01); B22F 2203/11 (2013.01); B22F 2302/45 (2013.01); B22F 2303/40 (2013.01); B23K 2101/38 (2018.08); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H10W 72/01323 (2026.01); H10W 72/07331 (2026.01); H10W 72/07336 (2026.01); H10W 72/07341 (2026.01); H10W 72/352 (2026.01); H10W 90/734 (2026.01);
Abstract

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

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