Company Filing History:
3 out of 44 
1 out of 832,680 Years Active: 2017-2025
Title: The Innovations of Paul Koep
Introduction
Paul Koep is an accomplished inventor based in Madison, NJ, known for his significant contributions to the field of solder materials. With a total of four patents to his name, he has made notable advancements that enhance the reliability and efficiency of electronic packaging applications.
Latest Patents
Among his latest patents is a solder material and method for die attachment. This innovative solder material comprises a solder alloy and a thermal conductivity modifying component. The solder material boasts a bulk thermal conductivity ranging between about 75 and about 150 W/m-K. This enhancement allows for optimal heat transfer and reliability in electronic packaging applications, making it a valuable asset in the industry.
Career Highlights
Throughout his career, Paul Koep has worked with various companies, including Alpha Assembly Solutions Inc. His expertise in solder materials has positioned him as a key player in the development of advanced electronic components.
Collaborations
Paul has collaborated with notable professionals in his field, including Michael T Marczi and Angelo Gulino. These partnerships have contributed to the successful development of his innovative solder materials.
Conclusion
Paul Koep's work in solder materials exemplifies the importance of innovation in enhancing electronic packaging applications. His patents reflect a commitment to improving thermal conductivity and reliability in the industry.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.