The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
May. 11, 2018
Applicant:
Alpha Assembly Solutions Inc., Waterbury, CT (US);
Inventors:
Angelo Gulino, Cranbury, NJ (US);
Bogdan Bankiewicz, Philadelphia, PA (US);
Oscar Khaselev, Monmouth Junction, NJ (US);
Anna Lifton, Bridgewater, NJ (US);
Michael T. Marczi, Chester, NJ (US);
Girard Sidone, Bordentown, NJ (US);
Paul Salerno, Bridgewater, NJ (US);
Paul J. Koep, Madison, NJ (US);
Assignee:
Alpha Assembly Solutions Inc., Waterbury, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); C22C 13/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); C22C 13/00 (2013.01); H01L 24/83 (2013.01); B23K 2101/42 (2018.08); H01L 2224/29209 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29216 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01);
Abstract
A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.