This inventor holds 2 USPTO granted patents and 1 published patent application and 2 EPO patents. Top assignee: Alpha Assembly Solutions Inc.. Active years: 2023-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023-2025
Title: The Innovations of Bogdan Bankiewicz
Introduction
Bogdan Bankiewicz is a notable inventor based in Philadelphia, PA. He has made significant contributions to the field of electronic packaging through his innovative solder materials. With a total of two patents to his name, Bankiewicz continues to push the boundaries of technology.
Latest Patents
His latest patents focus on a solder material and method for die attachment. This solder material comprises a solder alloy and a thermal conductivity modifying component. It boasts a bulk thermal conductivity of between about 75 and about 150 W/m-K. This innovation enhances the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
Career Highlights
Bankiewicz is currently employed at Alpha Assembly Solutions Inc., where he applies his expertise in solder materials. His work is crucial in developing solutions that improve electronic device performance and longevity.
Collaborations
Some of his notable coworkers include Angelo Gulino and Oscar Khaselev, who contribute to the innovative environment at Alpha Assembly Solutions Inc.
Conclusion
Bogdan Bankiewicz's contributions to solder materials and electronic packaging demonstrate his commitment to innovation and excellence in technology. His work continues to impact the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile