This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Alpha Assembly Solutions Inc.. Active years: 2023-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023-2025
Title: The Innovations of Angelo Gulino
Introduction
Angelo Gulino is a notable inventor based in Cranbury, NJ (US), recognized for his contributions to the field of solder materials and electronic packaging. With a total of two patents to his name, he has made significant strides in enhancing thermal conductivity in electronic applications.
Latest Patents
Gulino's latest patents focus on a solder material and method for die attachment. This innovative solder material comprises a solder alloy combined with a thermal conductivity modifying component. The resulting solder material boasts a bulk thermal conductivity ranging between about 75 and about 150 W/m-K. This enhancement allows for optimal heat transfer and reliability in electronic packaging applications, making it a valuable asset in the industry.
Career Highlights
Angelo Gulino is currently employed at Alpha Assembly Solutions Inc., where he continues to develop and refine solder materials for various applications. His work is pivotal in advancing technologies that require efficient thermal management.
Collaborations
Gulino collaborates with talented individuals such as Bogdan Bankiewicz and Oscar Khaselev, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Angelo Gulino's contributions to solder materials and electronic packaging demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of thermal conductivity, which is essential for the reliability of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile