Alpha Assembly Solutions Inc.

Other

Paul Koep

Michael T Marczi

Oscar Khaselev

Anna Lifton

Bogdan Bankiewicz

Angelo Gulino

Paul Salerno

Girard Sidone

Ellen Schwartz Tormey

Brian Lewis

Michiel A De Monchy

Martinus N Finke

A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

Solder material and method for die attachment

Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.

Materials for use with interconnects of electrical devices and related methods

A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

Solder preforms and solder alloy assembly methods

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Madison, NJ, United States of America

Paul Koep