Fry's Metals, Inc.

Olin Corporation

Alpha Metals, Inc.

Other

Alpha Assembly Solutions Inc.

Specialty Coating Systems, Inc.

Alpha Fry Limited

Brian Lewis

Bawa Singh

Michael T Marczi

Oscar Khaselev

Michael James Liberatore

John P Laughlin

Gerard R Minogue

Attiganal Narayanaswamy Sreeram

Ranjit Pandher

Leszek Hozer

Anthony E Ingham

Nitin Vithalbhai Desai

Siuli Sarkar

Sachin Parashar

David V Kyaw

John C Yarwood

Harvey P Cheskis

Sankaranarayanan Ashok

Peter J Kindlmann

Andreas Greiner

Robert H Detig

William G Watson

George J Muench

Phillip Hanefeld

Olaf Kriha

Sanyogita Arora

Dietmar C Eberlein

Rakesh Kumar

Paul Koep

John V Patton

Michiel A De Monchy

Martinus N Finke

Kenneth Reilly

Gerard Campbell

Mitchell Holtzer

Anthony Ingham

John Laughlin

Michael Liberatore

Gerard Minogue

Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.

Materials for use with interconnects of electrical devices and related methods

An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.

Solder alloy

Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.

Particles and inks and films using them

An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.

Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.

Metallic particles for electrokinetic or electrostatic deposition

In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.

Reducing joint embrittlement in lead-free soldering processes

A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applying the foregoing the substrate to yield a masked substrate; immersing the masked substrate in a bath containing the charged particles; and establishing an electrical potential between the conducting layer of the mask and a counter-electrode thereby electrokinetically depositing the particles through the mask openings onto areas of the substrate exposed in the mask openings. Products made by this method.

Mask and method for electrokinetic deposition and patterning process on substrates

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.

Thermal interface material and solder preforms

A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the substrate.

Method of applying a pattern of particles to a substrate

Preparation of metallic particles for electrokinetic or electrostatic deposition

Structures in the nanoscale and mesoscale domain are provided. The structures typically have a shell which can be comprised of a porous polymeric material such as parylene. The surfaces of the shell can further comprise pendant functional groups that can provide reactive or passive characteristics.

Methods of preparation of hollow microstructures and nanostructures

A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an active solder that contains indium and an intrinsic oxygen getter selected from the group consisting of alkali metals, alkaline-earth metals, refractory metals, rare earth metals and zinc and mixtures and alloys thereof. Lastly, damage due to an electronic package due to thermal cycling stress is reduced by using an insert in a lid of an electronic device package wherein the insert has a coefficient of thermal expansion that is between about that of the lid and about that of a semiconductor substrate.

Thermal interface material and heat sink configuration

The present invention relates to an electromagnetic system for applying a coating to a metal or metal alloy substrate. The system utilizes a high frequency electromagnetic field to maintain a supply of coating material in the molten condition, to restrict the flow of the molten coating material, and to control the thickness of the applied coating layer. Downstream cooling solidifies the coating layer. The system has particular utility in forming tin coated copper or copper base alloy products.

Electromagnetic solder tinning system

Growing community of inventors

Branford, CT, United States of America

Brian Lewis