The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Feb. 25, 2008
Brian G. Lewis, Branford, CT (US);
Bawa Singh, Voorhees, NJ (US);
John Laughlin, Tucson, AZ (US);
Ranjit Pandher, Plainsboro, NJ (US);
Brian G. Lewis, Branford, CT (US);
Bawa Singh, Voorhees, NJ (US);
John Laughlin, Tucson, AZ (US);
Ranjit Pandher, Plainsboro, NJ (US);
Fry's Metals, Inc., South Plainfield, NJ (US);
Abstract
In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.