Yongin, South Korea

Bok Kyu Choi

This inventor holds 27 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignees: Skhynix Inc., Hynix Semiconductor Inc.. Active years: 2010-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bok Kyu Choi. Retrieved from https://idiyas.com/inventor/bok-kyu-choi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 88.9

Average Co-Inventor Count = 1.4

ph-index = 3

Forward Citations = 33(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2010 - 2012)
  • Yongin-si Gyeonggi-do, KR (2021 - 2022)
  • Yongin-si, KR (2016 - 2023)
  • Icheon-si Gyeonggi-do, KR (2022 - 2023)
  • Icheon-si, KR (2022 - 2024)

Company Filing History:


Years Active: 2010-2025

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Areas of Expertise:
Stack Package
Semiconductor Package
Decoupling Device
Unit Capacitors
Interposer Bridge
Heat Dissipation
EMI Shielding
Through Mold Vias
Bridge Die
Contact Resistance
Conductive Shield
Stacked Chips
27 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Bok Kyu Choi in Semiconductor Technology

Introduction

Bok Kyu Choi, located in Yongin-si, South Korea, is a distinguished inventor with an impressive portfolio of 26 patents primarily focused on advancements in semiconductor technology. His contributions have significantly impacted the industry, showcasing his expertise in designing innovative stack packages and semiconductor configurations.

Latest Patents

Bok Kyu Choi's latest patents include intricate designs that optimize the functionality and efficiency of semiconductor packages. One of his notable inventions is a stack package that features a core die stacked over a controller die. This innovative design includes a core die equipped with memory cell arrays, interbank regions for decoders, and a pad region with connection pads facilitating electrical connections. The controller die plays a crucial role by managing the operations of the core die through strategically placed controller die through vias and circuitry.

Another significant patent pertains to a semiconductor package comprising a substrate, a first sub-semiconductor package with a buffer chip and a memory chip, and a second memory chip positioned above it. The interconnectivity between these components is achieved through advanced redistribution lines and bonding wires, showcasing Choi's commitment to enhancing semiconductor performance and reliability.

Career Highlights

Throughout his career, Bok Kyu Choi has worked with prominent companies in the semiconductor sector, including SK hynix and Hynix Semiconductor. His experiences in these organizations have not only allowed him to develop cutting-edge technologies but also contribute to the evolution of modern memory solutions.

Collaborations

Choi's innovative journey has involved collaborations with talented professionals in the industry, including notable coworkers such as Sang Joon Lim and Juil Eom. Their combined expertise likely amplified the development of groundbreaking semiconductor technologies and fostered a collaborative environment that encourages innovative thinking.

Conclusion

Bok Kyu Choi stands out as a significant figure in the realm of semiconductor innovation. With a strong focus on developing advanced packaging technologies, his contributions continue to shape the future of the semiconductor industry. As technology advances, inventors like Choi play a pivotal role in driving innovation and enhancing the performance of electronic devices across the globe.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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