The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Dec. 06, 2021
SK Hynix Inc., Icheon-si, KR;
Jeong Hyun Park, Icheon-si, KR;
Bok Kyu Choi, Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A semiconductor package may include: a substrate; a first sub-semiconductor package disposed over the substrate, the first sub-semiconductor package including a first buffer chip and a first memory chip; and a second memory chip disposed over the first sub-semiconductor package, wherein the first buffer chip and the first memory chip are connected to each other using a first redistribution line, and wherein the first buffer chip and the second memory chip are connected to each other using a second bonding wire.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile