The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Nov. 20, 2019
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Bok Kyu Choi, Yongin-si Gyeonggi-do, KR;
SK hynix Inc., Icheon-si Gyeonggi-do, KR;
Abstract
A stack package includes a package substrate having a bond finger and a stack of a first semiconductor die and a second semiconductor die. The first semiconductor die includes a first pad, a second pad, and a first redistributed line connecting the first and second pads to each other. The second semiconductor die includes a third pad, a fourth pad, and a second redistributed line connecting the third and fourth pads to each other. The first and third pads are connected to each other by a first interconnector which is bonded to the bond finger, and the second and fourth pads are connected to each other by a second interconnector.