The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Jun. 04, 2020
SK Hynix Inc., Icheon-si, KR;
Bok Kyu Choi, Yongin-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A semiconductor package includes a first sub-package on an interconnection layer. A second sub-package and a third sub-package are sequentially stacked on the first sub-package. Each of the first to third sub-packages includes a semiconductor chip and an interposing bridge. The interposing bridge includes a first through via and a second through via. The second sub-package further includes a first redistributed line electrically connecting the semiconductor chip of the second sub-package to the first through via. The third sub-package further includes a second redistributed line electrically connecting the semiconductor chip of the third sub-package to the second through via.