The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Jan. 21, 2021
SK Hynix Inc., Icheon-si, KR;
Bok Kyu Choi, Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A semiconductor package may include a base layer; a first semiconductor chip disposed over and spaced apart from the base layer; a second semiconductor chip stack disposed between the base layer and the first semiconductor chip, the second semiconductor chip stack including a plurality of second semiconductor chips that are stacked in a vertical direction; a bridge die stack disposed between the base layer and the first semiconductor chip and disposed to be spaced apart from the second semiconductor chip stack, the bridge die stack including a plurality of bridge dies that are stacked in the vertical direction and electrically connecting the first semiconductor chip and the base layer to supply power; and a vertical interconnector disposed between the base layer and the first semiconductor chip and disposed to be spaced apart from the second semiconductor chip stack and the bridge die stack, the vertical interconnector electrically connecting the first semiconductor chip and the base layer to transmit a signal.