The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2021

Filed:

Jun. 04, 2020
Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventor:

Bok Kyu Choi, Yongin-si, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/25175 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01);
Abstract

A stack package includes sub-packages vertically stacked. Each of the sub-packages includes a semiconductor chip having a power pad and a signal pad, a first interposer bridge having a signal through via and a second power through via, and a second interposer bridge having a first power through via. Each of the sub-packages further includes a signal redistributed layer pattern extending to electrically connect the signal pad to a signal connection part and a power redistributed layer pattern to electrically connect the power pad to the first and second power through vias. An upper sub-package of the sub-packages is rotated relative to a lower sub-package, and the rotated upper sub-package is stacked on a lower sub-package of the sub-packages.


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