The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Nov. 03, 2020
Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventors:

Ki Bum Kim, Icheon-si Gyeonggi-do, KR;

Bok Kyu Choi, Icheon-si Gyeonggi-do, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 23/3121 (2013.01); H01L 23/5329 (2013.01); H01L 25/0657 (2013.01);
Abstract

A semiconductor chip may include: a body portion including a front surface and a back surface; penetrating electrodes penetrating the body portion; and back connection electrodes disposed over the back surface of the body portion and connected to the penetrating electrodes, wherein the penetrating electrodes include a power penetrating electrode for transmitting a power voltage and a ground penetrating electrode for transmitting a ground voltage, the back connection electrodes include a power back connection electrode connected to the power penetrating electrode and a ground back connection electrode connected to the ground penetrating electrode, and one power back connection electrode is connected with two or more power penetrating electrodes, and one ground back connection electrode is connected with two or more ground penetrating electrodes.


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