IDiyas

For the Inventor, By the Inventor

Cork City, Ireland

Bharani Chava

USPTO Granted Patents = 13 

Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Cork, BE (2022)
  • Cork, IE (2022 - 2023)
  • Cork City, IE (2021 - 2024)

Company Filing History:

goldMedal13 out of 41,326 
 
Qualcomm Incorporated
 patents

Years Active: 2021-2024

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13 patents (USPTO):
1. 11876085 - Package with a substrate comprising an embedded capacitor with side wall coupling (2024-01-16),
2. 11830819 - Package comprising integrated devices and bridge coupling top sides of integrated devices (2023-11-28),
3. 11764186 - Package comprising an integrated device configured for shareable power resource (2023-09-19),
4. 11749327 - Memory bit cell circuit including a bit line coupled to a static random-access memory (SRAM) bit cell circuit and a non-volatile memory (NVM) bit cell circuit and a memory bit cell array circuit (2023-09-05),
5. 11710733 - Vertical power grid standard cell architecture (2023-07-25),
6. 11668735 - Granular sensing on an integrated circuit (2023-06-06),
7. 11552055 - Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking, and related fabrication methods (2023-01-10),
8. 11515289 - Stacked die integrated with package voltage regulators (2022-11-29),
9. 11437379 - Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits (2022-09-06),
10. 11430797 - Package embedded programmable resistor for voltage droop mitigation (2022-08-30),
11. 11270991 - Integrated circuits (ICs) employing front side (FS) back end-of-line (BEOL) (FS-BEOL) input/output (I/O) routing and back side (BS) BEOL (BS-BEOL) power routing for current flow organization, and related methods (2022-03-08),
12. 11195793 - Metal filling in a dielectric layer under metal layer one (M1)and above an active device layer in semiconductor devices (2021-12-07),
13. 11176991 - Compute-in-memory (CIM) employing low-power CIM circuits employing static random access memory (SRAM) bit cells, particularly for multiply-and-accumluate (MAC) operations (2021-11-16),

Title: Innovator Bharani Chava: Pioneering Advances in Integrated Technology

Introduction

Bharani Chava, based in Cork City, Ireland, is a prominent inventor recognized for his substantial contributions to integrated technology. With an impressive portfolio of 13 patents, Chava has made significant strides in developing advanced packaging solutions that enhance device performance and connectivity.

Latest Patents

Chava's latest innovations include two notable patents. The first is a package with a substrate comprising an embedded capacitor with side wall coupling. This invention features a substrate that includes a dielectric layer and multiple interconnects, housing a capacitor that improves electrical connectivity and efficiency. The configuration allows for robust coupling of solder interconnects to the capacitor terminals, facilitating improved device integration.

The second patent is a package comprising integrated devices with bridge coupling. This design supports direct connections between multiple integrated devices on the substrate through specialized bridges, optimizing electrical pathways for better performance. The innovation provides dual electrical paths, ensuring efficient communication between devices, which is crucial for modern technological applications.

Career Highlights

Chava is currently employed at Qualcomm Incorporated, a leading company in wireless technology and telecommunications. His expertise in integrated circuit design and packaging has helped drive forward the innovative solutions that Qualcomm is renowned for. Throughout his career, he has consistently demonstrated a deep understanding of the technical challenges and market demands within the electronics sector.

Collaborations

Working alongside talented colleagues such as Stanley Seungchul Song and Abinash Roy, Chava has fostered a collaborative environment that encourages innovative thinking and problem-solving. Their joint efforts have been pivotal in refining and advancing the technologies that underpin Chava's patents, showcasing the power of teamwork in driving innovation.

Conclusion

Bharani Chava continues to make significant contributions to the field of integrated technology through his inventive spirit and dedication to innovation. As he develops groundbreaking solutions that enhance device integration and performance, Chava stands as a key figure in the evolution of electronics, influencing the future of technology through his invaluable patents and collaborative endeavors.

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