The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Sep. 09, 2020
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Bharani Chava, Cork City, IE;
Stanley Seungchul Song, San Diego, CA (US);
Abinash Roy, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/78 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/50 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/19105 (2013.01);
Abstract
An integrated circuit (IC) package is described. The IC package includes a first die having a first power delivery network on the first die. The IC package also includes a second die having a second power delivery network on the second die. The first die is stacked on the second die. The IC package further includes package voltage regulators integrated with and coupled to the first die and/or the second die within a package core of the integrated circuit package.