1. Qualcomm Incorporated (13 from 41,783 patents)

1. 11876085 - Package with a substrate comprising an embedded capacitor with side wall coupling

2. 11830819 - Package comprising integrated devices and bridge coupling top sides of integrated devices

3. 11764186 - Package comprising an integrated device configured for shareable power resource

4. 11749327 - Memory bit cell circuit including a bit line coupled to a static random-access memory (SRAM) bit cell circuit and a non-volatile memory (NVM) bit cell circuit and a memory bit cell array circuit

5. 11710733 - Vertical power grid standard cell architecture

6. 11668735 - Granular sensing on an integrated circuit

7. 11552055 - Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking, and related fabrication methods

8. 11515289 - Stacked die integrated with package voltage regulators

9. 11437379 - Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits

10. 11430797 - Package embedded programmable resistor for voltage droop mitigation

11. 11270991 - Integrated circuits (ICs) employing front side (FS) back end-of-line (BEOL) (FS-BEOL) input/output (I/O) routing and back side (BS) BEOL (BS-BEOL) power routing for current flow organization, and related methods

12. 11195793 - Metal filling in a dielectric layer under metal layer one (M1)and above an active device layer in semiconductor devices

13. 11176991 - Compute-in-memory (CIM) employing low-power CIM circuits employing static random access memory (SRAM) bit cells, particularly for multiply-and-accumluate (MAC) operations