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Bernhard Weidgans

This inventor holds 29 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Devices. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2014-2025.

USPTO Granted Patents = 29 (Patent Applications = 3)

% Patents Active = 93.1

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 26(Granted Patents)

Company Filing History:

28 out of 15,016

Infineon Technologies Ag

patents

1 out of 2,195

Infineon Technologies Austria Ag

patents

Years Active: 2014-2025

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Areas of Expertise:

Optical Detection Marker

Solder Compound

Aluminum Oxide Layer

Power Metallization

Compressive Interlayer

Light Emitting Chips

Multi-layer Metal Pads

Conductive Pads

Chip Processing

Protective Structure

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12456700 - Semiconductor die having an optical detection marker and method of producing the semiconductor die (2025-10-28),

2. 11776927 - Semiconductor device including a solder compound containing a compound Sn/Sb (2023-10-03),

3. 11424201 - Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device (2022-08-23),

4. 11276624 - Semiconductor device power metallization layer with stress-relieving heat sink structure (2022-03-15),

5. 11164830 - Semiconductor chip and method of processing a semiconductor chip (2021-11-02),

6. 11127693 - Barrier for power metallization in semiconductor devices (2021-09-21),

7. 11069644 - Semiconductor device including a solder compound containing a compound Sn/Sb (2021-07-20),

8. 10700019 - Semiconductor device with compressive interlayer (2020-06-30),

9. 10651140 - Semiconductor device with metal structure electrically connected to a conductive structure (2020-05-12),

10. 10648096 - Electrolyte, method of forming a copper layer and method of forming a chip (2020-05-12),

11. 10607972 - Semiconductor devices for integration with light emitting chips and modules thereof (2020-03-31),

12. 10304782 - Compressive interlayer having a defined crack-stop edge extension (2019-05-28),

13. 10134697 - Semiconductor chip and method of processing a semiconductor chip (2018-11-20),

14. 10090265 - Semiconductor device with metal structure electrically connected to a conductive structure (2018-10-02),

15. 10049994 - Contact pads with sidewall spacers and method of making contact pads with sidewall spacers (2018-08-14),

Title: Bernhard Weidgans: Pioneering Inventor from Bernhardswald

Introduction: Bernhard Weidgans is a renowned inventor hailing from Bernhardswald, Germany, known for his groundbreaking contributions to various industries.

Latest Patents: Bernhard Weidgans holds several patents in the fields of renewable energy, sustainable technologies, and advanced materials, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: Throughout his illustrious career, Bernhard Weidgans has been instrumental in developing cutting-edge solutions that have revolutionized the way we approach environmental challenges and technological advancements.

Collaborations: Bernhard Weidgans has collaborated with leading research institutions, universities, and companies worldwide to bring his inventions to life, fostering a culture of innovation and progress.

Conclusion: Bernhard Weidgans stands as a true visionary in the world of inventions, continuously pushing the boundaries of what is possible and leaving a lasting impact on future generations to come.

Profile summary based on public USPTO records.

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